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Double-sided grinding and polishing, also known as double-sided lapping and polishing is performed with particles suspended in a liquid vehicle to abrade parts equally from both surfaces. The process produces a relatively stress-free environment that induces minimal thermal distortion making it compatible with most optical materials.
DOI: 10.1016/J.PRECISIONENG.2017.09.001 Corpus ID: 139856592. Study on the double-sided grinding of sapphire substrates with the trajectory method @article{Wang2018StudyOT, title={Study on the double-sided grinding of sapphire substrates with the trajectory method}, author={Lijuan Wang and Zhongwei Hu and Congfu Fang and Yiqing Yu and Xipeng Xu}, …
A. Saitoh, H. Masahiko, Grinding method of vertical type double-head surface grinding machine for machining brake disk, Japanese Patent …
Applicable Industries：electronic equipment, Surface cleaning&attaching polarizer After Warranty Service:video technical support Marketing Type:New Product202...
Double-sided planetary grinding is a new process for the rapid thinning and flattening of sapphire, and experiments with it were carried out on sapphire substrates with four commonly used crystal ...
US8911281B2 US13/181,619 US201113181619A US8911281B2 US 8911281 B2 US8911281 B2 US 8911281B2 US 201113181619 A US201113181619 A US 201113181619A US 8911281 B2 US8911281 B2 US 8911
Method for simultaneous double-sided grinding of a plurality of semiconductor wafers and semiconductor wafer with excellent flatness CN101277464B (en) : : : InFlex network system as well as method for settling stopping machine of work access position register
Fine Grinding (flat parts – single or double-side) is the abrasive machining process for removing material using a bonded Superabrasive wheel at low speed with a liquid to keep the part cool. The fixed grain of a geometrically indefinable cutting shape acts like a plow (fig. 3) and material is removed by micro-grooving /-cutting (fig. 4).
Double-sided lapping with the relocatable upper plate is different from double-sided grinding with stationary upper plate which the parallelism of workpiece depends on the machine accuracy. Compared with the single-sided lapping, both of the surfaces are machined at the same time with similar removal mechanism and the efficiency doubles by ...
METHOD FOR DOUBLE-SIDED REMOVAL MACHINING OF DISK-SHAPED WORKPIECES, IN PARTICULAR SEMICONDUCTOR DISCS JPH01153273A (en) * : : Cable Ltd: Grinding method for semiconductor wafer JPH03266430A (en) * : : Fujitsu Ltd: Carrier US5193316A (en) * :
Grinding papers come with different types of backing . Plain-backed or non-adhesive backing PSA or pressure sensitive backing Foil or polyester plastic backing Plain-backed papers are the least expensive, however, they require either a double sided adhesive or a paper holding ring.
A kinematic model was established on the basis of the double-sided planetary grinding movement. The double-sided planetary grinding equipment structure is shown in Fig. 1, which consists mainly of an upper and lower plate as well as the sun wheel that rotates around the respective axis.The workpieces are placed in planetary wheels that are driven by the sun …
A double-sided machine tool assembled with two grinding tools was designed for the finishing of the blade . A nine-axis milling machine tool with twin cutters was introduced in [ 11 ], where a generalized kinematic model of the machine tool was built and the feedrate was planned for the synchronous movements of two cutters.
Double sided V butt Double sided bevel butt Double sided U butt weld Symbol . Name Fillet Resistance Spot Resistance Steam . Name Finish Weld Symbol on Symbol base platform weld . Consumable insert entirely around Symbol on base platform weld . Name Weld between points Weld on site Staggered
Symmetric double-sided two-way ranging is a well-known technique to deal with clock drift in time-of-flight measurements between unsynchronised devices. However, the requirement for symmetric reply delays is often not feasible. This paper presents an alternative way to process double-sided two-way ranging measurements that eliminates the need ...
The process is a manufacturing method that employs particles of abrasive material to remove stock from a surface. It is comparable to sanding or grinding, except that sanding and grinding use abrasives that are fixed (bonded abrasives) whereas professional lapping services employs abrasives that are suspended in a liquid carrier and are free to ...
Crownkyn Superhard GC-2M84100B double-sided grinder can meet the requirements of high precision surface grinding or fine grinding, by removing the excess material on the two surfaces of the parts, can obtain extremely accurate geometric precision and surface finish.
The bearing roller is an important component of bearings [].Thus, the dimension accuracy and consistency of bearing rollers in the field of manufacturing have a considerable influence on the performance of the bearing [2,3,4]mon methods for machining cylindrical rollers include the centerless grinding method [5,6,7,8,9,10,11,12,13,14], double-sided …
Prime silicon wafer is hard and brittle material. Due to its properties, double sided lapping machine with ceramic grinding agent were introduced for machining high quality standard silicon wafers. The main focus is the silicon wafer with high accuracy of flatness; to reduce total thickness variation, waviness and roughness.
In double-side polishing of semiconductor wafers, not only the two main surfaces but also the surface of the edge portion can be polished in one operation with cost reduction and freedom from contamination. An apparatus with twin polishing turn tables is used in the double-side polishing and the inner peripheral edge of each carrier hole formed in a wafer carrier is profiled such …
Double-sided simultaneous grinding method, double-sided simultaneous grinding machine, double-sided simultaneous lapping method, and double-sided simultaneous lapping machine: : Ikeda et al. 4432245: Grinding machine motor with a torque sensor: : Hattori et al. 73/862.321
Method for double-sided polishing of a semiconductor wafer, comprising a simultaneous two-sided polishing of a semiconductor wafer located in a recess of a rotor disk between a top polishing pad covered with a first polishing cloth and a bottom polishing pad covered with a second polishing cloth, wherein the wafer located in the rotor disk is temporarily during …
True to its name, double disk grinding uses two opposing abrasive wheels to grind two sides of a material at the same time. This makes it a very efficient grinding method for achieving a tight tolerance surface finish, flatness, and parallelism in the right applications. Yet there is somewhat of an aura of mystery surrounding double disk grinding.
Simultaneous double side grinding (SDSG) is one of the processes to flatten the wire-sawn wafers. This paper reviews the literature on SDSG of silicon wafers, covering the history, machine development (including machine configuration, drive and support systems, and control system), and process modeling (including grinding marks and wafer shape).
Double Disc Surface Grinding Machine. We designed for high precision grinding of the two paralell surfaces of flat metallic parts such as bearing, valve plate, carbide chip, seal, oil pump vane, piston ring, etc. It can also grind the flat surfaces of non-metallic parts of hard & brittle materials like glass and ceramics.
The double-sided batch wise machining of the workpieces is characteristic for the machining process. The kinematics and arrangement of the tools are similar to the double face plane-lapping from which the manufacturing process originated. In contrast to this, double face grinding is carried out using bonded abrasive and cooling lubricant.
Double-sided planetary grinding as an efficient and precise machining method is used for the rapid thinning and flattening process of sapphire substrate. As an intermediate processing technology of sapphire substrate preparation procedure, many experiments are carried out to evaluate the lapping effect in the paper. Surface quality, processing efficiency, and surface …
Double disk grinding is like two-sided Blanchard grinding, in that it removes material more quickly than a method such as surface grinding. (Of course, with any abrasive method, material removal speed depends on the …
Home > Products > Polishing Pad, Double Sided Surface Grinding. CATEGORY Vitrified Diamond & CBN Wheel. The vitrified diamond grinding wheel used in thermal spraying coating PCD PCBN CVD Tools Grinding Wheel Peripheral Grinding of CBN Inserts - Vit diamond wheel.
Double-Disc Grinding is a highly efficient grinding method that reduces pre-machining costs up to 50% and provides dimensional tolerances, parallelism, and flatness up to ±.001″. (For even tighter tolerances, see our Surface Grinding process.) Double-Disc Grinding uses two opposing abrasive wheels to simultaneously grind two sides of the ...
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